LOAD LOCK Chamber (option) LOAD LOCK預真空進樣室（可選） Chamber with front open door 前開門蒸發腔體 Cryopump and dry pump 冷凝泵和幹泵 Multiple thermal evaporation sources or OLED sources 多個熱阻蒸發源或OLED低溫蒸發源 Max. 6” substrate 6”基片 Substrate rotation 基片旋轉 Substrate bias (option) 基片偏壓（可選） Ion source for substrate cleaning (option) 離子源清洗基片（可選） Substrate heating to 1000C (option) 基片加熱1000度(可選) Crystal rate monitor and film thickness control 晶振沉積速率及膜厚控制 Manual or automatic system control 係統手動或自動控制 For deposition of metal, semiconductor and insulation materials 可沉積金屬、半導體和絕緣材料 For deposition of multi-layer or alloy film |
可沉積多層膜及合金薄膜
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