±M·~¨î³y¡]PCB¡^½u¸ôªO¼t®a,²`¦`¥«®¦³Ð¹q¤l¦³¤½¥q¤½¥q¡AªL¥Í¡G
17850558356 QQ:3167153352 ºô©ö¶l½c
xmpcb888@163.com
§Ú¥q¬O¤@®a¦b²`¦`§ë«Øªº´ä¸ê¥ø·~¥Dn¥Í²£«×¡B³æÂù±¡B¦h¼hè©Ê¤Î³n©Ê½u¸ôªO,¤½¥q¥þ®M±Ä¥Î¥ý¶iªº¹q¸ôªO¥Í²£³]³Æ¡A¶×¶°¸gÅçÂ×´Iªº±M·~¤H¤~¶i¦æºÞ²z¡C¤Þ¶i·sªº¤uÃÀ§Þ³N½T«O¯à´£¨Ñ¥i¾a¡B§Ö³tªº²£«~µ¹«È¤á¡C¾Ö¦³¦h¦~ªº¥Í²£ºÞ²z¸gÅç¡C¬O¤@®a³W¼Ò±j¤j.³]³Æ§¹µ½.ºÞ²zÄY®æ.«~½èªº±M·~¹q¸ôªO¥Í²£¼t®a¡C¥Dn²£«~À³¥Î©ó³q«H³]³Æ¡BÀË´ú,¹q¸£,µ¥»â°ì¡C
½è¶q©M«HÅA¬O¥ø·~ªº¥Í©R¡A¥»¤½¥q¤@ª½¥H¨Ó³£§â¡§½è¶q²Ä¤@¡A«HÅA²Ä¤@¡¨©^¬°©v¦®¡A¤£Â_§ïµ½²£«~ªº½è¶q¡A´£°ª¤½¥qªº«HÅA«×¡F¦h¦~¨Ó¥»µÛÀu¨}ªº²£«~½è¶q¡B²a®É§Ö±¶ªº¨Ñ³f©M©P¨ì²ÓPªºªA°È¡A²`±o«È¤áªº¦nµû¡F¦b¥«³õ¤W¨É¦³¬Û·íªº«×¡A¤½¥q³e¹ý¹ê¦æ¡§«È¤áº¡·N¡A¯u¸ÛªA°È,°l¨D¡A«i©ó³Ð·s.¡¨ªº¥ø·~ºë¯«¡C§Ṳ́w¸gÀò±o¨}¦nªºÁnÅA¨Ã¦¨¬°¤@ӫȤá¥i«H¿àªº¡B¯àªø´Á¦X§@ªºPCB¥Í²£°Ó¡C
§Þ³N«ü¼Ð¡þ¥[¤u¯à¤O
1.«È¨Ñ¸ê®Æ¤è¦¡¡G(Date Supply for the Customers)
µáªL(Film)¡B¼ËªO(Sample)¡BCAD¸ê®Æ(CAD Date) (PROTEL;PADS2000)
2.¼Å»ÉªO ( Coat¡XCopper Laminates ): FR4, CEM1,CEM3,F4B-3
3.«p«× (Thickness)¡G0.2---3.0mm
4.¥¬½u¼h¼Æ (Circuit Layers)¡G³æ±¡þÂù±¡þ¦h¼h(4--16¼h)
5.²Ó¾É½u¡þ¶¡¶Z¡@¡]Min Circuit / SPACE¡^:
4MIL / 0.1mm ( Ni / Au )ªO 4MIL/ 0.1mm (¼Q Sn / PnªO)
6.¤p¤Õ®| (Min Hole Diameter): 0.3mm
7.¤jªO«p¡þ¤Õ®|¤ñ (Max Thickness / Hole D ): 5
8.¤j¥[¤u¤Ø¤o (Max Outline) : 750¡Ñ700mm
9.ªý²kªo (Solder mask ink):
¼ö©Tªo (»OÆW¤t¸Î¤½¥q: 402¡B401)¡@·P¥úªo¡@(¤é¥»TAMURA:DSR¡X2200) µ¥
10.ÁáÒ\¼h(Plating / Coacing ):¡@¹qÁáNi / Au ,¡@¡@¼QSn / Pb
11.¥~§Î¥[¤u(Outline Process):¡@¼Æ±±»ÑÃä,¡@½Ä,¤Á,V³Î,ºë«× : - 0.2mm~0.2mm
12.¤ë¥[¤u¯à¤O¡G(Process capablity/Month): 5000m2
13.¤é¥[¤u¯à¤O¡G(Process capablity/Day): 200 m2
14.¥æ³f©P´Á¡G(Delivery Date): ¼ËªO1-4¤Ñ¡F³æÂù±§å¶q¡G5-7¤Ñ¡F¥|¼h§å¶q7-9¤Ñ¡F¤»¼h§å¶q8-10¤Ñ
15.Å禬¼Ð·Ç¡G(Acceptance Standrd):¡@°ê¼Ð¡B¥ø¼Ð¡A«È¼Ð