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1.«È¨Ñ¸ê®Æ¤è¦¡¡G(Date Supply for the Customers)
µáªL(Film)¡B¼ËªO(Sample)¡BCAD¸ê®Æ(CAD Date) (PROTEL;PADS2000)
2.¼Å»ÉªO ( Coat¡XCopper Laminates ): FR4, CEM1,CEM3,F4B-3
3.«p«× (Thickness)¡G0.2---3.0mm
4.¥¬½u¼h¼Æ (Circuit Layers)¡G³æ±¡þÂù±¡þ¦h¼h(4--20¼h)
5.²Ó¾É½u¡þ¶¡¶Z¡@¡]Min Circuit / SPACE¡^:
4MIL / 0.1mm ( Ni / Au )ªO 4MIL/ 0.1mm (¼Q Sn / PnªO)
6.¤p¤Õ®| (Min Hole Diameter):0.1mm
7.¤jªO«p¡þ¤Õ®|¤ñ (Max Thickness / Hole D ): 5
8.¤j¥[¤u¤Ø¤o (Max Outline) : 600¡Ñ700mm
9.ªý²kªo (Solder mask ink):
¼ö©Tªo (»OÆW¤t¸Î¤½¥q: 402¡B401)¡@·P¥úªo¡@(¤é¥»TAMURA:DSR¡X2200) µ¥
10.ÁáÒ\¼h(Plating / Coacing ):¡@¹qÁáNi / Au ,¡@¡@¼QSn / Pb
11.¥~§Î¥[¤u(Outline Process):¡@¼Æ±±»ÑÃä,¡@½Ä,¤Á,V³Î,ºë«× : - 0.2mm~0.2mm
12.¤ë¥[¤u¯à¤O¡G(Process capablity/Month): 5000m2
13.¤é¥[¤u¯à¤O¡G(Process capablity/Day): 200 m2
14.¥æ³f©P´Á¡G(Delivery Date): ¼ËªO1-4¤Ñ¡F³æÂù±§å¶q¡G5-7¤Ñ¡F¥|¼h§å¶q7-9¤Ñ¡F¤»¼h§å¶q8-10¤Ñ
15.Å禬¼Ð·Ç¡G(Acceptance Standrd):¡@°ê¼Ð¡B¥ø¼Ð¡A«È¼Ð