SHL2-4000半片全自動激光劃片裂片機介紹
一、半片全自動激光劃片裂片機設備
二、全自動激光劃片裂片機功能
適用於單晶硅和多晶硅材料太陽電池1/2等分劃片和裂片,能夠完成自動給料、自動定位劃片、自動裂片、小片自動裝盒等功能。
三、設備技術參數
四、全自動激光劃片裂片機性能特點
1、劃片工藝
採用532nm綠光光源,光程固定,光束質量好,激光劃線寬度細,熱影響區小;電池片切割斷面更整齊,對電池片損傷小,切割
2、工作效率高
激光劃片速度快,整機自動劃程度高,設備產能可達3400整片/小時
3、定位
電池片CCD視覺定位,機器臂取片,定位精度 0.1mm
4、自動化程度高
料盒自動傳輸、電池片自動上下料、自動定位、自動劃片、自動裂片、小片自動裝盒。性能穩定,故障率低,維護簡單。
應用市場
太陽能行業單晶硅、多晶硅、硅片的劃片(切割切片)。
太陽能行業單晶硅、多晶硅(cel太陽能行業單晶硅、多晶硅和硅片的劃片/切割切片)。
電子行業單晶硅和多晶硅硅片的分離切割。
1、Equipment Introduction
Applied to scribe&split mono-crystalline silicon and poly-crystalline silicon solar cell into 1/2 piece, which can achieve automatic cell loading,automatic positioning scribing,automatic cell splitting,small cell load in box automatically and so on.
2、Technology Parameters
Model SHL2-4000
Laser power 20W
laser wavelength 532nm
Scribing speed Maximum 600mm/s
Scribing line width 25μm
Hot affected area 60μm
Scribing line depth 20-120μm;(adjustable)
Scribing accuracy ±0.1mm
Positioning method CCD visual positioning
Cell breaking method Mechanical cell breaking
Scribing capacity 3400 full cells/hr
Breakage rate 1 (Positive A class)
Solar cell specification 156×156-158×158mm
Size 2000×1500×1800mm
Net Weight 1200kg
3、Equipment Feature
Advanced scribing technology
adopt 532nm green laser,fixed light path,good quality beam,slim laser scribing line,small hot affected area;more uniform solar cell cutting surface,small damage to solar cell,high accuracy cutting.
High working efficiency
High laser scribing speed that could reach to 3400pcs/hr, high automation level
High accuracy positioning
Solar cell CCD visual positioning, high accuracy mechanical arm cell loading, positioning accuracy 0.1mm
High automation level
Cell basket automatic transfer, solar cell automatic loading and unloading, automatic positioning, automatic scribing, small cell load in box automatically. Stable performance, low failure rate, easy maintenance